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Electronic adhesive
To provide customers with a variety of electronic adhesives, including semiconductor /LED chip packaging adhesive, automobile structural adhesive, conductive adhesive, thermal grease, epoxy adhesive, silicon adhesive, acrylic adhesive, polyurethane adhesive, MS glue and other electronic adhesives with different systems in various fields. Its applications cover various fields such as semiconductor, LED, microelectronics, composite materials, automobiles and new energy.
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Electronic chemicals
Customize some exclusive Master-batch and Varnish materials according to customers' requirements, and provide the raw materials used with them, including high performance epoxy resin (flexible and folding resistant epoxy, high Tg epoxy, special structure epoxy, modified epoxy, etc.), latent curing agent (ultra-low temperature curing latent curing agent, high Tg latent curing agent, liquid latent curing agent, solid latent curing agent, etc.), and special additives (accelerator, toughening agent,
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Printed circuit boards and 5G ...
With the advent of 5G era, higher requirements are put forward for materials used in 5G communication equipment. besides materials used in conventional printed circuit boards, we also provide customers with high-performance materials used in 5G equipment, including modified polyphenylene ether, Low Dk/Low Df thermoplastic elastomer, modified bismaleimide resin, crosslinking agent, peroxide, filling materials, etc.
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Industrial consume material
To provide customers with supporting consumables for electronic industry applications, including pure adhesive film, conductive adhesive film, release paper release film, heat-resistant PET, kraft paper, heat-resistant transparent substrate, covering film and other materials, bringing customers one-stop purchasing experience.
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